● High-quality device to perform bulk etching silicon wafers surfaces with O3 and HF.
● No droplets generate on wafer surface because of etching with gas.
● Uniformity / Flatness of wafers after etching process is within 10%.
● Contaminants generated during etching process do not move to other places.
● Bulk etching is performed on the entire surface with wafers, but partial evaluation is also possible by mapping
collecting.
● Wafers are handled manually, however the equipment is controlled on PC, it is easy to operate.
| Device Name | BEM-310 | |||||||
| Wafer Size | 200mm、300mm | |||||||
| Operation | PC | |||||||
| Bulk Etching Function | 〇 | |||||||
| Recovery Rate | within ±10% | |||||||
| Uniformity / Flatness of Wafers after Etching Process |
within ±10% | |||||||
| Size (W×D×H) (*1) | 1000×1300×2000(mm) | |||||||
| Weight | About 150Kg | |||||||
| Recommended Environment | Inside Clean Draft | |||||||
| Utilities | O2, N2, HF, DIW, AC-100-200V, Acid Drain & Exhaust, General Exhaust |
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