● Obtained International Patent for bevel recovery.
● The world's top-class function and technology in collecting hydrophilic surface.
● High-efficiency equipment to perform following process on silicon wafers by automatically;
VPD Process -> Scanning wafer surface and sampling contaminants -> Dilution of sampling solution
● An extremely effective device when it is necessary to take a sample from a large number of wafers at one time and analyze it.
● Sampling nano metal contamination from surface and sides (bevel parts) of silicon wafers.
● Able to collect contamination of both hydrophobic and hydrophilic wafer surfaces.
* Please note that bevel parts are when hydrophobic wafers only.
● Can process bulk etching.
● Uniformity / Flatness of wafers after etching process is within 10%.
● A function of measuring and diluting the sampling solution, and prevents the work from continuing with the
solution remaining on the wafer.
● Double door prevents the acid atmosphere in devices from mixing with contaminants on the operator.
● Automatically clean the liquid holder used for sampling. It will lead to saving time of operators
(Compatible with both normal and bevel holders).
There has been a significantly high need for the device that performs all following process automatically in these days
for the purpose of reducing contamination (Applicable by NAC-316);
Bulk etching -> Sampling contaminations -> ICP-MS connection & elemental analysis
|Bulk Etching Function||ー||〇||〇|
|ICP-MS Auto Connection||ー||ー||〇|
|Automatic Preparation of
ICP-MS Calibration Curve
|Basic Sampling Pattern||Ring-shaped, Fixed Radius, Side (Bevel)|
|Size (W×D×H) (*1)||1300×1200×2000(mm)||1800×1350×2000(mm)||1600×2700×2000(mm)|
|Equipment used||Acid drainage，General exhaust，Acid exhaust|
|Inside Clean Draft|
|Utilities||N2, CDA, DIW,
|O2, N2, CDA, DIW, AC-100V 15A,
Acid Drain & Exhaust, General Exhaust